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ES9039MSPRO 数据表(PDF) 93 Page - ESS Technology,Inc |
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ES9039MSPRO 数据表(HTML) 93 Page - ESS Technology,Inc |
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93 / 95 page  ES9039MPRO & ES9039PRO Datasheet CONFIDENTIAL ADVANCE INFORMATION 0.2.1 93 ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 • WWW.ESSTECH.COM RPC-2 Pb-Free Process – Classification Temperatures (Tc) Package Thickness Volume mm3, <350 Volume mm3, 350 to 2000 Volume mm3, >2000 <1.6 mm 260°C 260°C 260°C 1.6 mm – 2.5 mm 260°C 250°C 245°C >2.5 mm 250°C 245°C 245°C Table 11 – RPC-2 Pb free classification temperatures At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc). Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. |
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