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TLV341 数据表(PDF) 18 Page - Texas Instruments

部件名 TLV341
功能描述  TLV34xx Low-Voltage Rail-to-Rail Output CMOS Operational Amplifiers With Shutdown
PDF  40 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TLV341 数据表(HTML) 18 Page - Texas Instruments

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NC
VCC+
IN1
í
IN1+
VCC
í
NC
OUT
NC
RG
RIN
RF
GND
VIN
VS-
GND
VS+
GND
Run the input traces as far
away from the supply lines
as possible
Only needed for
dual-supply
operation
Place components close to
device and to each other to
reduce parasitic errors
Use low-ESR, ceramic
bypass capacitor
(or GND for single supply)
Ground (GND) plane on another layer
VOUT
+
RIN
RG
RF
VOUT
VIN
18
TLV341, TLV341A, TLV342, TLV342S
SLVS568D – JANUARY 2005 – REVISED APRIL 2016
www.ti.com
Product Folder Links: TLV341 TLV341A TLV342 TLV342S
Submit Documentation Feedback
Copyright © 2005–2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
Connect low-ESR, 0.1-
μF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply
applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds while paying attention to the flow of the ground current.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting
input minimizes parasitic capacitance, as shown in Layout Guidelines.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
10.2 Layout Example
Figure 39. Layout Schematic
Figure 40. Operational Amplifier Schematic for Noninverting Configuration



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