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BUT11AF 数据表(PDF) 3 Page - NXP Semiconductors |
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BUT11AF 数据表(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AF Fig.3. Test circuit resistive load. V IM = -6 to +8 V V CC = 250 V; tp = 20 µs; δ = tp / T = 0.01. R B and RL calculated from ICon and IBon requirements. Fig.4. Switching times waveforms with resistive load. Fig.5. Test circuit inductive load. V CC = 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH Fig.6. Switching times waveforms with inductive load. Fig.7. Normalised power derating and second breakdown curves. Fig.8. Reverse bias safe operating area. T j ≤ Tj max tp T VCC R R T.U.T. 0 VIM B L IC IB ICon IBon -IBoff t t ts tf toff 10 % 90 % 0 20 40 60 80 100 120 140 Ths / C % Normalised Derating 120 110 100 90 80 70 60 50 40 30 20 10 0 with heatsink compound P tot IC IB 10 % 10 % 90 % 90 % ton toff ts tf IBon -IBoff ICon tr 30ns 6 5 4 3 2 1 0 0 400 800 1200 IC / A BUT11AX VCE / V LB IBon -VBB LC T.U.T. VCC August 1997 3 Rev 1.000 |
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