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CC2400-RTR1 数据表(PDF) 77 Page - Texas Instruments |
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CC2400-RTR1 数据表(HTML) 77 Page - Texas Instruments |
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77 / 83 page ![]() CC2400 SWRS042A Page 77 of 83 51 Recommended layout for package (QFN48) Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via holes distributed symmetrically in the ground pad under the package. See also the CC2400EM reference design. 52 Package Thermal Properties Thermal resistance Air velocity [m/s] 0 Rth,j-a [K/W] 25.6 53 Soldering Information Recommended soldering profile for both standard leaded packages and Pb-free packages is according to IPC/JEDEC J-STD-020B, July 2002. |
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