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SIM800L 数据表(PDF) 66 Page - SIMCom |
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SIM800L 数据表(HTML) 66 Page - SIMCom |
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66 / 73 page  Smart Machine Smart Decision 7.2. Typical Solder Reflow Profile Figure 58: Typical solder reflow profile of lead-free processes 7.3. The Moisture Sensitivity Level The moisture sensitivity level of SIM800H&SIM800L module is 3. The modules should be mounted within 168 hours after unpacking in the environmental conditions of temperature <30 and relative humidity of <60% (RH). ℃ It is necessary to bake the module if the above conditions are not met: Table 57: Moisture sensitivity level and floor life Moisture Sensitivity Level (MSL) Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated 1 Unlimited at 30 /85% RH ≦℃ 2 1 year 2a 4 weeks 3 168 hours 4 72 hours 5 48 hours 5a 24 hours 6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. Note: For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed. SIM800H&SIM800L_Hardware Design_V2.02 66 2015-07-27 |
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