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BYD52J 数据表(PDF) 3 Page - NXP Semiconductors

部件名 BYD52J
功能描述  Fast soft-recovery controlled avalanche rectifiers
PDF  8 Pages
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制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors

BYD52J 数据表(HTML) 3 Page - NXP Semiconductors

  BYD52J Datasheet HTML 1Page - NXP Semiconductors BYD52J Datasheet HTML 2Page - NXP Semiconductors BYD52J Datasheet HTML 3Page - NXP Semiconductors BYD52J Datasheet HTML 4Page - NXP Semiconductors BYD52J Datasheet HTML 5Page - NXP Semiconductors BYD52J Datasheet HTML 6Page - NXP Semiconductors BYD52J Datasheet HTML 7Page - NXP Semiconductors BYD52J Datasheet HTML 8Page - NXP Semiconductors  
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1998 Dec 03
3
Philips Semiconductors
Preliminary specification
Fast soft-recovery controlled
avalanche rectifiers
BYD52 series
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper layer
≥40 µm,
pitch 5 mm; see Fig.6.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
note 1
150
K/W



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