1999 Nov 11

2

Philips Semiconductors

Product specification

Ultra-fast soft-recovery

controlled avalanche rectifiers

BYD57 series

FEATURES

• Glass passivated

• High maximum operating

temperature

• Low leakage current

• Excellent stability

• Guaranteed avalanche energy

absorption capability

• Shipped in 8 mm embossed tape

• Smallest surface mount rectifier

outline.

DESCRIPTION

Cavity free cylindrical glass SOD87

package through Implotec

technology. The SOD87 is

hermetically sealed and fatigue free

as coefficients of expansion of all

used parts are matched.

(1) Implotec is a trademark of Philips.

handbook, 4 columns

MAM061

ka

Fig.1 Simplified outline (SOD87) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

repetitive peak reverse voltage

BYD57D

−

200

V

BYD57G

−

400

V

BYD57J

−

600

V

BYD57K

−

800

V

BYD57M

−

1000

V

BYD57U

−

1200

V

BYD57V

−

1400

V

continuous reverse voltage

BYD57D

−

200

V

BYD57G

−

400

V

BYD57J

−

600

V

BYD57K

−

800

V

BYD57M

−

1000

V

BYD57U

−

1200

V

BYD57V

−

1400

V

average forward current

averaged over any 20 ms period;

see also Figs 10 and 11

BYD57D to M

−

1.0

A

BYD57U and V

−

1.2

A

average forward current

Fig.17); see Figs 4 and 5;

averaged over any 20 ms period;

see also Figs 10 and 11

BYD57D to M

−

0.4

A

BYD57U and V

−

0.4

A

repetitive peak forward current

BYD57D to M

−

8.5

A

BYD57U and V

−

11

A