AD8224ACPZ-R7 datasheet(9/28 Pages) AD

9 / 28 page

AD8224

Rev. 0 | Page 9 of 28

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter

Rating

Supply Voltage

±18 V

Power Dissipation

See Figure 2

Output Short Circuit Current

Indefinite1

Input Voltage (Common Mode)

±Vs

Differential Input Voltage

±Vs

Storage Temperature

−65°C to +130°C

Operating Temperature Range2

−40°C to +125°C

Lead Temperature Range (Soldering, 10 sec)

300°C

Junction Temperature

130°C

Package Glass Transition Temperature

130°C

ESD (Human Body Model)

4 kV

ESD (Charge Device Model)

1 kV

ESD (Machine Model)

0.4 kV

1 Assumes the load is referenced to mid supply.

Temperature for specified performance is −40°C to +85°C. For performance

to +125°C, see the

Typical Performance Characteristics section.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions may affect device reliability.

THERMAL RESISTANCE

Table 9.

Thermal Pad

θJA

Unit

Soldered to Board

°C/W

Not Soldered to Board

°C/W

The θJA values in Table 9 assume a 4-layer JEDEC standard

board. If the thermal pad is soldered to the board, then it is

also assumed it is connected to a plane. θJC at the exposed pad

is 4.4°C/W.

Maximum Power Dissipation

The maximum safe power dissipation for the AD8224 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 130°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality.

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the LFCSP on a 4-layer

JEDEC standard board.

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–60

–40

–20

100

120

140

AMBIENT TEMPERATURE (°C)

θJA = 48°C/W WHEN THERMAL PAD

IS SOLDERED TO BOARD

θJA = 86°C/W WHEN THERMAL PAD

IS NOT SOLDERED TO BOARD

Figure 2. Maximum Power Dissipation

ESD CAUTION

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