数据搜索系统，热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

预览 PDF HTML

AD8331ARQZ-R7 数据表(PDF) 39 Page - Analog Devices

部件名 AD8331ARQZ-R7
功能描述  Ultralow Noise VGAs with Preamplifier and Programmable RIN
PDF  40 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD8331ARQZ-R7 数据表(HTML) 39 Page - Analog Devices

Back Button AD8331ARQZ-R7 Datasheet HTML 32Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 33Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 34Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 35Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 36Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 37Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 38Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 39Page - Analog Devices AD8331ARQZ-R7 Datasheet HTML 40Page - Analog Devices  
Zoom Inzoom in Zoom Outzoom out
 39 / 40 page
background image
AD8331/AD8332/AD8334
Rev. E | Page 39 of 40
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
14
1
8°
0°
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 95. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AD
20
11
10
1
PIN 1
8°
0°
0.010
0.004
0.012
0.008
0.025
BSC
COPLANARITY
0.004
0.065
0.049
0.069
0.053
SEATING
PLANE
0.010
0.006
0.050
0.016
0.345
0.341
0.337
0.158
0.154
0.150
0.244
0.236
0.228
Figure 96. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in Inches
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
Figure 97. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com