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AT45DB081B-RU 数据表(PDF) 28 Page - ATMEL Corporation |
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AT45DB081B-RU 数据表(HTML) 28 Page - ATMEL Corporation |
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28 / 33 page  28 AT45DB081B 2225I–DFLSH–9/05 Note: Green packages cover lead-free requirements. Ordering Information f SCK (MHz) ICC (mA) Ordering Code Package Operation Range Active Standby 20 10 0.01 AT45DB081B-CC AT45DB081B-CNC AT45DB081B-RC AT45DB081B-TC 14C1 8CN3 28R 28T Commercial (0 °C to 70°C) 20 10 0.01 AT45DB081B-CI AT45DB081B-CNI AT45DB081B-RI AT45DB081B-TI 14C1 8CN3 28R 28T Industrial (-40 °C to 85°C) 15 10 0.01 AT45DB081B-CC-2.5 AT45DB081B-CNC-2.5 AT45DB081B-RC-2.5 AT45DB081B-TC-2.5 14C1 8CN3 28R 28T Commercial (0 °C to 70°C) 2.5V to 3.6V Green Packaging Options (Pb/Halide-free) fSCK (MHz) ICC (mA) Ordering Code Package Operation Range Active Standby 20 10 0.01 AT45DB081B-CNU AT45DB081B-RU AT45DB081B-TU AT45DB081B-CU 8CN3 28R 28T 14C1 Industrial (-40 °C to 85°C) Package Type 14C1 14-ball (3 x 5 Array), Plastic Chip-scale Ball Grid Array (CBGA) 8CN3 8-pad (6 mm x 8 mm ) Chip Array Small Outline No Lead Package (CASON ) 28R 28-lead, 0.330" Wide, Plastic Gull Wing Small Outline Package (SOIC) 28T 28-lead, Plastic Thin Small Outline Package (TSOP) |
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