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BYV42EX 数据表(PDF) 2 Page - NXP Semiconductors |
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BYV42EX 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 7 page ![]() Philips Semiconductors Product specification Rectifier diodes BYV42F, BYV42EX series ultrafast, rugged ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V C Electrostatic discharge Human body model; - 8 kV capacitor voltage C = 250 pF; R = 1.5 k Ω ISOLATION LIMITING VALUE & CHARACTERISTIC T hs = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V isol R.M.S. isolation voltage from all SOT186A package; f = 50-60 Hz; - 2500 V three terminals to external sinusoidal waveform; R.H. ≤ 65%; heatsink clean and dustfree V isol Repetitive peak voltage from all SOT186 package; R.H. ≤ 65%; - 1500 V three terminals to external clean and dustfree heatsink C isol Capacitance from pin 2 to f = 1 MHz - 10 - pF external heatsink THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-hs Thermal resistance junction to both diodes conducting heatsink with heatsink compound - - 4.0 K/W without heatsink compound - - 8.0 K/W per diode with heatsink compound - - 5.0 K/W without heatsink compound - - 9.0 K/W R th j-a Thermal resistance junction to in free air - 55 - K/W ambient ELECTRICAL CHARACTERISTICS characteristics are per diode at T j = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V F Forward voltage I F = 15 A; Tj = 150˚C - 0.83 0.90 V I F = 15 A - 0.95 1.05 V I F = 30 A - 1.00 1.20 V I R Reverse current V R = VRWM; Tj = 100 ˚C - 0.5 1 mA V R = VRWM - 10 100 µA Q s Reverse recovery charge I F = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs- 6 15 nC t rr1 Reverse recovery time I F = 1 A; VR ≥ 30 V; - 20 28 ns -dI F/dt = 100 A/µs t rr2 Reverse recovery time I F = 0.5 A to IR = 1 A; Irec = 0.25 A - 13 22 ns I rrm Peak reverse recovery current I F = 10 A; VR ≥ 30 V; - 2 2.4 A -dI F/dt = 50 A/µs; Tj = 100˚C V fr Forward recovery voltage I F = 1 A; dIF/dt = 10 A/µs- 1 - V October 1998 2 Rev 1.300 |
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