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V200Z-R 数据表(PDF) 3 Page - List of Unclassifed Manufacturers |
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V200Z-R 数据表(HTML) 3 Page - List of Unclassifed Manufacturers |
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3 / 22 page ![]() V200Z-R FN-LINK TECHNOLOGY LIMITED 3 CONTENTS 1. General Description.................................................................................................................. 5 1.1 Introduction........................................................................................................................... 5 1.2 Description............................................................................................................................ 5 1.3 EVB information...................................................................................................................5 2. Features......................................................................................................................................6 3. General Specification................................................................................................................ 7 3.1 Wi-Fi 2.4GHz Specification..................................................................................................7 3.2 Wi-Fi 5GHz Specification.....................................................................................................7 3.3 Bluetooth Specification.........................................................................................................9 4. Block Diagram.........................................................................................................................10 *5. ID setting information.......................................................................................................... 10 6. Pin Definition...........................................................................................................................11 6.1 Pin Outline...........................................................................................................................11 6.2 Pin Definition details.......................................................................................................... 12 6.3 GPIO MUX Mapping......................................................................................................... 15 7. Electrical Specifications..........................................................................................................15 7.1 Absolute Maximum RatingsNote4.........................................................................................15 7.2 Operating Conditions..........................................................................................................16 7.3 Power consumption.............................................................................................................16 8. Size reference...........................................................................................................................17 8.1 Module Picture....................................................................................................................17 8.2 Marking Description........................................................................................................... 17 8.3 Physical Dimensions...........................................................................................................17 8.4 Layout Recommendation....................................................................................................18 9. The Key Material List............................................................................................................ 19 10. Recommended Reflow Profile..............................................................................................19 11. RoHS compliance..................................................................................................................20 12. Package.................................................................................................................................. 20 12.1 Reel................................................................................................................................... 20 12.2 Carrier Tape Detail............................................................................................................21 12.3 Packaging Detail............................................................................................................... 21 13. Moisture sensitivity...............................................................................................................22 |
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