November 2, 2006 21610D5

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D A TA

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REVISION SUMMARY

Revision A (June 1998)

Initial release.

Revision B (July 1998)

Distinctive Characteristics

Changed typical active read current to 30 mA to match

DC Characteristics table.

Operating Ranges

Corrected temperature range descriptions to “ambient.”

Revision C (January 1999)

Distinctive Characteristics

Added 20-year data retention subbullet.

Revision C+1 (April 14, 1999)

Deleted duplicate sections in the full data sheet.

Data Retention

Added table.

Revision D (November 17, 1999)

AC Characteristics—Figure 11. Program

Operations Timing and Figure 12. Chip/Sector

Erase Operations

high.

Physical Dimensions

Replaced figures with more detailed illustrations.

Revision D+1 (December 5, 2000)

Added table of contents.

Ordering Information

Deleted burn-in option.

Revision D+2 (November 8, 2004)

Global

Added cover page, colophon, and referenced links

Updated Trademark.

Ordering Information

Added temperature range for Pb-free Packages.

Valid Combinations

Added new combinations.

Revision D3 (December 22, 2005)

Global

Deleted 120 and 150 ns speed options, and deleted re-

verse TSOP package option.

Revision D4 (May 19, 2006)

Added “Not recommended for new designs” note.

AC Characteristics

Revision D5 (November 2, 2006)

Deleted “Not recommended for new designs” note.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable

to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those pr

Trademarks

Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are

trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Copyright © 1998–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.