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Am29BL802C

22371C7 November 3, 2006

D A TA

SH EET

Erase/Program Operations table, Alternate CE#

Controlled Erase/Program Operations table

Changed typical sector erase time from 3 s to 1 s.

Erase and Programming Performance

Changed typical/maximum sector erase time from 3

s/60 s to 5 s/15 s, respectively. Changed typical chip

erase time from 22 s to 45 s. Changed endurance to 1

million cycles.

Revision C+4 (June 4, 2004)

Ordering Information

Operating Ranges

Revision C+5 (February 28, 2005)

Ordering Information

Added Pb-free package information.

Valid Combinations Table

Revision C+6 (June 29, 2005)

Distinctive Characteristics

Changed bullet point value from 1,000,000 to 100,000.

Erase and Programming Performance

Changed values for “Sector Erase Time” and “Chip

Erase Time” parameters. Adjusted notes values from

1,000,000 to 100,000.

Ordering Information

Changed Extended temperature range to -40°C.

Revision C7 (November 3, 2006)

Sector Protection/Unprotection

Corrected reference to programming supplement pub-

lication number and location.

Erase and Program Operations table

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable

to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

Copyright © 1999–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.

Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are

trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.