AM29DL322DB70RWDI datasheet(55/56 Pages) AMD

55 / 56 page

Am29DL322D/323D/324D

December 13, 2005

Revision C+4 (July 2, 1999)

Device Bus Operations

Sector Address Tables: In the note below the tables,

corrected the bank address bit range for Am29DL323.

Revision C+5 (September 27, 1999)

Device Bus Operations

Sector Address tables: Corrected the bank address

bits specified.

Revision D (December 17, 1999)

Global

Changed Am29DL322C/323C to Am29DL322D/323D

to reflect new 0.23 µm process technology. Added 70

ns speed option.

AC Characteristics

Figure 17, Program Operations Timing; Figure 19,

Chip/Sector Erase Operations: Deleted t

GHWL and

changed OE# waveform to start at high.

Erase and Program Operations table; Alternate CE#

Controlled Erase and Program Operations table:

Changed the typical and maximum specifications for

programming time.

Erase and Programming Performance

In the table, changed the typical and maximum specifi-

cations for programming time.

Physical Dimensions

Replaced figures with more detailed illustrations.

Revision D+1 (June 21, 2000)

Global

Added information on the Am29DL324 device.

Device Bus Operations

Table 7, Autoselect Codes: The SecSi Sector Indicator

Bit values have changed from 80h and 00h to 81h and

01h, respectively.

Command Definitions

Table 14, Command Definitions: The SecSi Sector In-

dicator Bit values have changed from 80h and 00h to

81h and 01h, respectively.

Revision D+2 (August 3, 2000)

Block Diagram

Corrected “A0–A19” to “A0–A20”.

Table 3. Sector Addresses for Top Boot Sector

Devices

Changed the second occurrence of “Bank 2” in the

Am29DL324DT column to “Bank 1”. Added “A20 for

Am29DL324DT” to the note.

Table 5. Sector Addresses for Bottom Boot Sector

Devices

Changed the first occurrence of “Bank 2” in the

Am29DL324DB column to “Bank 1”. Added “A20 for

Am29DL324DB” to the note.

Revision D+3 (October 6, 2000)

Block Diagram

Added OE# and BYTE# inputs to lower bank section.

Ordering Information

Deleted burn-in option. Changed 70 ns speed option

from standard voltage range to regulated voltage

range.

Table 8, Top Boot Sector/Sector Block Addresses

for Protection/Unprotection

Corrected SA3 address range to 000011XXX.

RESET#: Hardware Reset Pin

Corrected reference to ICC current in DC Characteris-

tics table.

Revision D+4 (April 27, 2001)

Distinctive Characteristics, General Description,

SecSiTM (Secured Silicon) Sector Flash

Memory Region

Clarified that current version of device has 64 Kbyte

SecSi Sector; future versions will have 256 bytes.

Ordering Information

Added valid combinations for “N” designator.

Common Flash Memory Interface (CFI)

Modified first paragraph to indicate that the CFI Query

is not accessible when the device is executing an Em-

bedded Algorithm.

SecSi

TM (Secured Silicon) Sector Flash

Memory Region

Added note indicating that ACC and unlock bypass

are not available when programming the SecSi Sector.

Enter SecSiTM Sector/Exit SecSi Sector Command

Sequence

Added statement that SecSi Sector is not accessible

when the device is executing an Embedded Program

or Embedded Erase algorithm.

AM29DL322DB70RWDI 数据表(PDF) 55 Page - Advanced Micro Devices

AM29DL322DB70RWDI 数据表(HTML) 55 Page - Advanced Micro Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56

数据表下载

链接网址

AM29DL322DB70RWDI 数据表(PDF) 55 Page - Advanced Micro Devices

AM29DL322DB70RWDI 数据表(HTML) 55 Page - Advanced Micro Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56

数据表 下载

链接网址

数据表下载