12

Am29BL802C Known Good Die

SU PP L E ME NT

PRODUCT TEST FLOW

Figure 1 provides an overview of AMD’s Known Good

Die test flow. For more detailed information, refer to the

Am29BL802C product qualification database supple-

ment for KGD. AMD implements quality assurance pro-

cedures throughout the product test flow. In addition,

an off-line quality monitoring program (QMP) further

guarantees AMD quality standards are met on Known

Good Die products. These QA procedures also allow

AMD to produce KGD products without requiring or

implementing burn-in.

Figure 1.

AMD KGD Product Test Flow

Wafer Sort 1

Bake

24 hours at 250

°C

Wafer Sort 2

Wafer Sort 3

High Temperature

Packaging for Shipment

Shipment

DC Parameters

Functionality

Programmability

Erasability

Data Retention

DC Parameters

Functionality

Programmability

Erasability

DC Parameters

Functionality

Programmability

Erasability

Speed

Incoming Inspection

Wafer Saw

Die Separation

100% Visual Inspection

Die Pack