AM29BL802C datasheet(14/17 Pages) SPANSION

14 / 17 page

SU PP L E ME NT

Am29BL802C Known Good Die

PHYSICAL SPECIFICATIONS

Die dimensions . . . . . . . . . . . 269.7 mils x 214.2 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . 6.85 mm x 5.44 mm

Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . .500 µm

Bond Pad Size . . . . . . . . . . . . . . 3.74 mils x 3.74 mils

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 µm x 95 µm

Pad Area Free of Passivation . . . . . . . . . .13.99 mils2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded (optional)

Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

DC OPERATING CONDITIONS

VCC (Supply Voltage) . . . . . . . . . . . . . . . 3.0 V to 3.6 V

Operating Temperature

Industrial . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended . . . . . . . . . . . . . . . . . . –55

°C to +125°C

Super Extended . . . . . . . . . . . . –55

°C to +145°C

MANUFACTURING INFORMATION

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Wafer Sort Test . . . . . . . . . . . . Sunnyvale, CA, USA,

. . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia

Manufacturing ID (Bottom Boot) . . . . . . . . . . . . 98H11

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . CS39LS

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250

°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30

°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

standard ESD handling procedures.

DC PARAMETER EXCEPTIONS

The following specifications replace those given in the Am29BL802 data sheet (publication number 22371):

Notes:

3. Maximum ICC specifications are tested with VCC = VCCmax.

4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns.

Parameter

Description

Test Conditions

Typ

Max

Unit

ICC3

VCC Standby Current (Note 3)

CE#, RESET# = VCC±0.3 V

µA

ICC4

VCC Standby Current During Reset

(Note 3)

RESET# = VSS ± 0.3 V

µA

ICC5

Automatic Sleep Mode

(Notes 3, 4)

VIH = VCC ± 0.3 V;

VIL = VSS ± 0.3 V

OE# = VIH

µA

OE# = VIL

µA

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