50

Am29LV160D

May 5, 2006 22358B7

DA TA

SH EET

REVISION SUMMARY

Revision A (January 1999)

The Am29LV160D is fully form, fit, and function com-

patible with the Am29LV160B device, with the

following differences:

A 70 ns device at full voltage range is now available.

The 80 ns speed option has been deleted.

Byte and word programming times, and byte- and

word-mode chip programming times are now reduced.

At extended temperatures (>+85

°C), sleep and

standby currents increase.

Revision A+1 (April 19, 1999)

Global

Reclassified the document from advance information

to preliminary.

The 70 ns speed option is now also available with the

industrial and extended temperature range ratings.

Revision B (November 23, 1999)

AC Characteristics—Figure 17. Program

Operations Timing and Figure 18. Chip/Sector

Erase Operations

high.

Physical Dimensions

Replaced figures with more detailed illustrations.

Revision B+1 (February 22, 2000)

Global

Added dash to speed options.

Ordering Information

Added dash to OPN.

Revision B+2 (November 7, 2000)

Global

Deleted Preliminary status from data sheet. Deleted

burn-in option. Added table of contents.

Revision B+3 (November 10, 2000)

Command Definitions

Reset Command: Deleted reference to Figure 14, RE-

SET# Timings, which applies only to hardware reset.

Revision B+4 (April 5, 2004)

Erase/Program Operations

Revision B+5 (June 4, 2004)

Ordering Information

Added Pb-Free OPNs.

Revision B+6 (October 7, 2004)

Cover Sheet and Title Page

Added notation to superseding document.

Revision B7 (May 5, 2006)

Updated migration and obsolescence statement on

cover page and first page of data sheet.

Updated trademarks.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-

vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-

sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

Copyright © 1999–2006 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.