5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

IEC 61000-4-4

Electrical Fast

Transient

Peak Power at 25 °C

80

A

IEC 61000-4-5

Surge (tp

8/20µs

Peak Power at 25 °C

170

W

Peak Current at 25 °C

25

A

TA

Operating free-air temperature

–40

125

°C

Tstg

Storage temperature

–65

155

°C

(1)

Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If

used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional,

and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings - JEDEC Specifications

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all-pins(1)

±2500

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 ESD Ratings - IEC Specifications

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

±30000

V

IEC 61000-4-2 Air Discharge, all pins

±30000

5.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

0

3.6

V

TA

Operating Free Air Temperature

–40

125

°C

5.5 Thermal Information

THERMAL METRIC (1)

ESDS311

ESDS312

ESDS314

UNIT

DYF (SOD323)

DBV (SOT-23)

DBV (SOT-23)

2 PINS

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

739.2

163.9

127.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

287.7

113.4

78.9

°C/W

RθJB

Junction-to-board thermal resistance

605.5

76.9

43.9

°C/W

ΨJT

Junction-to-top characterization parameter

118.4

59.8

24.5

°C/W

ΨJB

Junction-to-board characterization parameter

591.1

76.8

43.7

°C/W

ESDS311, ESDS312, ESDS314

SLVSEG9C – MAY 2018 – REVISED FEBRUARY 2024

www.ti.com

4

Submit Document Feedback

Copyright © 2024 Texas Instruments Incorporated

Product Folder Links: ESDS311 ESDS312 ESDS314