5 Specifications

5.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage range

VCC

–0.3

7

V

Voltage range USB data

DxP, DxM

–0.3

5.5

V

Voltage range on EQ pin

EQ

-0.3

1.98

V

Voltage range other pins

RSTN

-0.3

5.5

V

Storage temperature, Tstg

–65

150

°C

Maximum junction temperature, TJ (max)

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011(2)

±750

(1)

AEC Q100-002 HBM ESD Classification Level 2

(2)

AEC Q100- 011 CDM ESD Classification Level C4A

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

2.3

5

6.5

V

TA

Operating free-air temperature (AEC-Q100)

–40

105

°C

TJ

Junction temperature (AEC-Q100)

115

°C

DxP, DxM

Voltage range USB data

0

3.6

V

EQ

Voltage range EQ pin

0

1.98

V

DIGITAL

Voltage range other pins (RSTN)

0

3.6

V

5.4 Thermal Information

THERMAL METRIC (1)

RWB (X2QFN)

UNIT

12 PINS

RθJA

Junction-to-ambient thermal resistance

137.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

62

°C/W

RθJB

Junction-to-board thermal resistance

67.2

°C/W

ψJT

Junction-to-top characterization parameter

1.9

°C/W

ψJB

Junction-to-board characterization parameter

67.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TUSB211A-Q1

SLLSFX8 – FEBRUARY 2024

www.ti.com

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