Philips Semiconductors

PCF85103C-2

256

Product data

Rev. 02 — 09 May 2002

13 of 20

9397 750 09646

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

13. Package outline

Fig 10. DIP8 package outline (SOT97-1).

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT97-1

95-02-04

99-12-27

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

1.15

4.2

0.51

3.2

inches

0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12

0.01

0.10

0.30

0.32

0.31

0.39

0.33

0.045

0.17

0.020

0.13

050G01

MO-001

SC-504-8

c

(e )

1

A

L

e

D

Z

8

1

5

4

b

E

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1