Philips Semiconductors

PCF85103C-2

256

Product data

Rev. 02 — 09 May 2002

17 of 20

9397 750 09646

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

14.4 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[3]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

Table 9:

Suitability of IC packages for wave, reflow and dipping soldering methods

Mounting

Soldering method

Wave

Dipping

Through-hole

mount

−

suitable

Surface mount

BGA, LBGA, LFBGA,

SQFP, TFBGA, VFBGA

not suitable

suitable

−

HBCC, HBGA, HLQFP,

HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN,

HVSON, SMS

suitable

−

suitable

suitable

−

LQFP, QFP, TQFP

suitable

−

SSOP, TSSOP, VSO

suitable

−