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PCF8575 数据表(PDF) 13 Page - NXP Semiconductors |
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PCF8575 数据表(HTML) 13 Page - NXP Semiconductors |
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13 / 24 page ![]() 1999 Apr 07 13 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. Note 1. Stress above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is a stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 9 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under “Handling MOS Devices”. 10 CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS =0V; Tamb = −40 to +85 °C; unless otherwise specified. SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage −0.5 +6.5 V IDD supply current −±100 mA ISS supply current −±100 mA VI input voltage VSS − 0.5 VDD + 0.5 V II DC input current −±20 mA IO DC output current −±25 mA Ptot total power dissipation − 400 mW PO power dissipation per output − 100 mW Tstg storage temperature −65 +150 °C Tamb operating ambient temperature −40 +85 °C SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage 2.5 − 5.5 V IDD supply current operating mode; no load; VI =VDD or VSS; fSCL = 400 kHz − 100 200 µA IDD(stb) standby current standby mode; no load; VI =VDD or VSS − 2.5 10 µA VPOR power-on reset voltage note 1 − 1.2 1.8 V VIL1 LOW-level input voltage pins A0, A1 and A2 0.0 − 0.2VDD V VIL2 LOW-level input voltage on all other signal pins 0.0 − 0.3VDD V VIH HIGH-level input voltage 0.7VDD − VDD V IL1 leakage current at pins A0, A1 and A2 VI =VDD or VSS −1 − +1 µA |
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