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PCF8578U/2 数据表(PDF) 37 Page - NXP Semiconductors |
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PCF8578U/2 数据表(HTML) 37 Page - NXP Semiconductors |
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37 / 44 page ![]() 1998 Sep 08 37 Philips Semiconductors Product specification LCD row/column driver for dot matrix graphic displays PCF8578 Table 15 Bonding pad locations (dimensions in µm) All x/y coordinates are referenced to centre of chip, see Fig.28. PAD NUMBER SYMBOL x y PINS VSO56 LQFP64 1 SDA 174 2241 1 7 2 SCL −30 2241 2 8 3 SYNC −234 2241 3 9 4 CLK −468 2241 4 10 5VSS −726 2241 5 11 6 TEST −1014 2241 6 12 7 SA0 −1308 2241 7 13 8 OSC −1308 1917 8 16 9VDD −1308 1113 9 20 10 V2 −1308 873 10 21 11 V3 −1308 663 11 22 12 V4 −1308 459 12 23 13 V5 −1308 255 13 24 14 VLCD −1308 51 14 25 15 C39 −1308 −1149 17 29 16 C38 −1308 −1353 18 30 17 C37 −1308 −1557 19 31 18 C36 −1308 −1773 20 32 19 C35 −1308 −1995 21 33 20 C34 −1308 −2241 22 34 21 C33 −1014 −2241 23 35 22 C32 −726 −2241 24 37 23 R31/C31 −468 −2241 25 38 24 R30/C30 −234 −2241 26 39 25 R29/C29 −30 −2241 27 40 26 R28/C28 174 −2241 28 41 27 R27/C27 468 −2241 29 42 28 R26/C26 672 −2241 30 43 29 R25/C25 876 −2241 31 44 30 R24/C24 1080 −2241 32 45 31 R23/C23 1308 −2241 33 46 32 R22/C22 1308 −1977 34 48 33 R21/C21 1308 −1731 35 49 34 R20/C20 1308 −1515 36 50 35 R19/C19 1308 −1305 37 51 36 R18/C18 1308 −1101 38 52 37 R17/C17 1308 −897 39 53 |
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