NLAST44599

http://onsemi.com

3

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

Positive DC Supply Voltage

*0.5 to )7.0

V

V

Digital Select Input Voltage

V

DC Current, Into or Out of Any Pin

$50

mA

Power Dissipation in Still Air

QFN−16

TSSOP−16

800

450

mW

Storage Temperature Range

*65 to )150

°C

Lead Temperature, 1 mm from Case for 10 Seconds

260

°C

Junction Temperature Under Bias

+150

°C

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 30% − 35%

UL−94−VO (0.125 in)

ESD Withstand Voltage

Human Body Model (Note 1)

Machine Model (Note 2)

Charged Device Model (Note 3)

2000

200

1000

V

$300

mA

Thermal Resistance

QFN−16

TSSOP−16

80

164

°C/W

Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these conditions

or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions is

not implied. Functional operation should be restricted to the Recommended Operating Conditions.

1. Tested to EIA/JESD22−A114−A.

2. Tested to EIA/JESD22−A115−A.

3. Tested to JESD22−C101−A.

4. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage

2.0

5.5

V

Digital Select Input Voltage

GND

5.5

V

Analog Input Voltage (NC, NO, COM)

GND

V

Operating Temperature Range

*55

)125

°C

Input Rise or Fall Time, SELECT

0

0

100

20

ns/V

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature °C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature

TIME, YEARS