TMG49037 datasheet(71/79 Pages) OSRAM

71 / 79 page

Page 70

ams Datasheet

Document Feedback

[v1-01] 2019-Aug-20

TMG49037 − Soldering and Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 76:

Solder Reflow Profile

Figure 77:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5 °C/s

Soak time

tsoak

2 to 3 minutes

Time above 217 °C (T1)

Max 60s

Time above 230 °C (T2)

Max 50s

Time above Tpeak – 10 °C (T3)

Max 10s

Peak temperature in reflow

Tpeak

260 °C

Temperature gradient in cooling

Max -5 °C/s

Soldering and Storage

Information

Not to Scale

Tpeak

Time in seconds

TMG49037 数据表(PDF) 71 Page - OSRAM GmbH

TMG49037 数据表(HTML) 71 Page - OSRAM GmbH

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79

数据表下载