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3SM122HZB1VD-R 数据表(PDF) 1 Page - Solid State System Co., Ltd. |
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3SM122HZB1VD-R 数据表(HTML) 1 Page - Solid State System Co., Ltd. |
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1 / 14 page ![]() Version 1.3 Date: 2023-04-19 - 1 - MEMS Microphone IC 3SM122HZB1VD-R WWW.3SYSTEM.COM.TW 3SM122HZB1VD-R MEMS Microphone IC Product Description The 3SM122HZB1VD-R microphone IC are integrated with specialized pre-amplification ASIC to provide high sensitivity, high SNR output from a capacitive audio sensor. It’s packaged for surface mounting and high temperature reflow assembly. 3SM122HZB1VD-R which is able to endure reflow temperature up to 260 ℃ for 30 seconds can be used in SMT process. It is widely used in telecommunication and electronics device such as headset, wearable device. Features • Bottom port • High stability - no risk of membrane aging • Suitable for automatic pick-and-place handler and SMT process • Miniature dimension 2.75mm x 1.85mm x 0.90mm • Low current consumption 80uA • RoHS/Green compliant • Sensitivity deviation within ±1dB • Package type : LGA 4-pin • Omnidirectional Applications • ANC Headsets • TWS Headsets • Wearable Devices • IoT Devices |
类似零件编号 - 3SM122HZB1VD-R |
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类似说明 - 3SM122HZB1VD-R |
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