Version 1.3

Date: 2023-04-19

- 10 -

MEMS Microphone IC

3SM122HZB1VD-R

WWW.3SYSTEM.COM.TW

Handling Instructions

The MEMS microphone IC can be handled using standard pick-and-place and chip-shooting

equipment. Care should be taken to avoid damage to the MEMS microphone IC structure as

follows:

•

Do not apply vacuum nozzle over the acoustic port (AP) of the microphone to avoid

damage to the device.

•

Do not blow air directly into acoustic port.

If air gun cleaning is required, the

minimum distance is 10cm and the maximum air blow pressure is 30psi.

•

Brushing the board with/without solvents may damage the device.

•

Do not use excessive force to place the microphone on the PCB.

•

In case of manual handling, it should be handled with plastic tweezers to avoid damage

to the device.

•

Do not open and remove IC from packaging until devices are ready to be mounted.

•

Suggest PCB depaneling be done with depaneling cutter/router, or manually de-panel

PCB with care and without any contact of MEMS Microphone IC.