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ML2002 数据表(PDF) 12 Page - Minilogic Device Corporation Limited |
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ML2002 数据表(HTML) 12 Page - Minilogic Device Corporation Limited |
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12 / 13 page ![]() P12/13 Preliminary, November 2008 ML2002 Preliminary 1. To ensure the good flip-chip assembly quality, we suggest flip-chip bonding house add a “CHECK” pin for each COG module as shown on the section of “Application Example”. Pin “LOAD” and Pin “CHECK” shall be connected together if the flip-chip assembly is in good condition. The measured resistance between Pin “LOAD” and Pin “CHECK” shall not more than 5 kohm. 2. The resistance of ITO glass shall between 15 ohm/□ to 25 ohm/□. 3. Each Common (ie. COM1A and COM1B) shall not cover more than 2,000 mm2 area. In case the Viewing area of LCD has to be more than 2,000 mm2, more common output has to be used. Example : Note : COM1A and COM1B shall cover half of the Viewing Area (ie. Area = 1,300mm2) Each Common shall not connect to each other. Application Note |
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