GaAs SP3T 2.5 V High Power Switch

0.1 - 3.0 GHz

MASWSS0100

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

•

North America Tel: 800.366.2266 / Fax: 978.366.2266

•

Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

•

Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

V2

1

Features

• Low Voltage Operation: 2.5V

• Low Harmonics: -70 dBc at +34 dBm & 1 GHz

• Low Insertion Loss: 0.5 dB at 1 GHz

• High Isolation: 20 dB at 2 GHz

• 0.5 micron GaAs PHEMT Process

• Supplied as Known Good Die

Description

M/A-COM’s MASWSS0100 is a GaAs PHEMT

MMIC single pole three throw (SP3T) high power

switch die. The MASWSS0100 is ideally suited for

applications where high power, low control voltage,

low insertion loss, high isolation, small size and low

cost are required.

Typical applications are for GSM, DCS and PCS

handset systems that connect separate transmit and

receive functions to a common antenna, as well as

other handset and related applications.

This part

can be used in all systems operating up to 2.5 GHz

requiring high power at low control voltage.

The MASWSS0100 is fabricated using a 0.5 micron

gate length GaAs PHEMT process.

The process

features

full

passivation

for

performance

and

reliability.

Part Number

Product Description

MASWSS0100-DIE

Separated Die on Grip Ring

1

1. Die quantity varies.

Pad Name

Description

V1

Control 1

RF1

RF Port 1

RF2

RF Port 2

V2

Control 2

RF3

RF Port 3

V3

Control 3

RFC

Antenna/Common Port

Pad Configuration

Parameter

Absolute Maximum

Input Power

+38 dBm

Voltage

± 8.5 volts

Operating Temperature

-40°C to +85°C

Storage Temperature

-65°C to +150°C

2. Exceeding any one or combination of these limits may cause

permanent damage to this device.

3. M/A-COM does not recommend sustained operation near

these survivability limits.

Die Bond Pad Layout

V1

V3

RFC

RF1

RF2

V2

RF3