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EXAMPLE STENCIL DESIGN

20X (1.5)

20X (0.45)

18X (0.65)

(5.8)

(R0.05) TYP

(2.96)

BASED ON

0.125 THICK

STENCIL

(2.96)

BASED ON

0.125 THICK

STENCIL

PowerPAD TSSOP - 1.2 mm max height

PWP0020T

SMALL OUTLINE PACKAGE

4224598/A 10/2018

2.50 X 2.50

0.175

2.70 X 2.70

0.15

2.96 X 2.96 (SHOWN)

0.125

3.31 X 3.31

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

SYMM

SYMM

1

10

11

20

METAL COVERED

BY SOLDER MASK

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

21