MPC862P datasheet(10/88 Pages) FREESCALE

10 / 88 page

MPC862/857T/857DSL PowerQUICC™ Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal Characteristics

Table 3 shows the thermal characteristics for the MPC862/857T/857DSL.

Power Dissipation

Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,

and 2:1 mode, where CPU frequency is twice bus speed.

Table 3. MPC862/857T/857DSL Thermal Resistance Data

Rating

Environment

Symbol

Value

Unit

Junction to ambient 1

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board,

and board thermal resistance.

Natural Convection

Single layer board (1s)

RθJA

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

°C/W

Four layer board (2s2p)

RθJMA

Per JEDEC JESD51-6 with the board horizontal.

Air flow (200 ft/min)

Single layer board (1s)

RθJMA

Four layer board (2s2p)

RθJMA

Junction to board 4

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature

is measured on the top surface of the board near the package.

RθJB

Junction to case 5

Indicates the average thermal resistance between the die and the case top surface as measured by the cold

plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature. For exposed pad packages where the pad would be expected to be soldered, junction to case

thermal resistance is a simulated value from the junction to the exposed pad without contact resistance.

RθJC

Junction to package top 6

Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2.

Natural Convection

ΨJT

Air flow (200 ft/min)

ΨJT

Table 4. Power Dissipation (PD)

Die Revision

Frequency

Typical 1

Maximum 2

Unit

(1:1 Mode)

50 MHz

656

735

66 MHz

TBD

A.1, B.0

(1:1 Mode)

50 MHz

630

760

66 MHz

890

1000

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