MPX2200

Sensors

Freescale Semiconductor

5

Figure 4. Cross Sectional Diagrams (Not to Scale)

differential or gauge die in the basic chip carrier (Case 344).

A silicone gel isolates the die surface and wire bonds from the

environment, while allowing the pressure signal to be

transmitted to the silicon diaphragm.

The MPX2200 series pressure sensor operating

characteristics and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor

performance and long term reliability. Contact the factory for

information regarding media compatibility in your application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing the silicone gel

which isolates the die from the environment. The differential

or gauge sensor is designed to operate with positive

differential pressure applied, P1 > P2. The absolute sensor is

designed for vacuum applied to P1 side.

The Pressure (P1) side may be identified by using

Figure 3.

Lead Frame

Wire Bond

Differential/Gauge

Die

Silicone Gel

Die Coat

Differential/Gauge

P2

Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

P1

Silicone Gel

Die Coat

Absolute

Die

P1

Metal Cover

Epoxy

Case

Absolute Element

P2

Lead Frame

Wire Bond

Die

Bond

Stainless Steel

Element

Table 3. Pressure (P1) Side Delineation

Part Number

Case Type

Pressure (P1) Side Identifier

MPX2200A/D

344

Stainless Steep Cap

MPX2200DP

344C

Side with Part Marking

MPX2200AP/GP

344B

Side with Port Attached

MPX2200GVP

344D

Stainless Steep Cap