MPX4115A MPXA4115A SERIES

5

Motorola Sensor Device Data

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

fottprint, the packages will self–align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and short-

ing between solder pads.

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

Figure 5. SOP Footprint (Case 482)

inch

mm

SCALE 2:1

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005