MPX5010

Sensors

4

Freescale Semiconductor

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the Differential or Gauge configuration

in the basic chip carrier (Case 482). A fluorosilicone gel

isolates the die surface and wire bonds from the environment,

while allowing the pressure signal to be transmitted to the

sensor diaphragm.

The MPX5010 and MPXV5010G series pressure sensor

operating characteristics, and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects on

sensor performance and long-term reliability. Contact the

factory for information regarding media compatibility in your

application.

Figure 3 shows the recommended decoupling circuit for

interfacing the integrated sensor to the A/D input of a

microprocessor or microcontroller. Proper decoupling of the

power supply is recommended.

Figure 4 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0° to 85°C using the decoupling circuit shown in Figure 3. The

output will saturate outside of the specified pressure range.

Figure 2. Cross-Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646.)

Figure 4. Output versus Pressure Differential

Fluoro Silicone

Gel Die Coat

Wire Bond

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Differential Sensing

Element

P2

+5 V

1.0 µF

0.01 µF

470 pF

GND

IPS

OUTPUT

Lead

Frame

Differential Pressure (kPa)

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

0

1

2

3

4

5

6

7

8

9

11

10

TYPICAL

MIN

MAX

Transfer Function:

TEMP = 0 to 85°C