MPX5010

Sensors

6

Freescale Semiconductor

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

Part Number

Case Type

Pressure (P1)

Side Identifier

MPX5010D

867

Stainless Steel Cap

MPX5010DP

867C

Side with Part Marking

MPX5010GP

867B

Side with Port Attached

MPX5010GS

867E

Side with Port Attached

MPX5010GSX

867F

Side with Port Attached

MPXV5010G6U

482

Stainless Steel Cap

MPXV5010G7U

482B

Stainless Steel Cap

MPXV5010GC6U/T1

482A

Side with Port Attached

MPXV5010GC7U

482C

Side with Port Attached

MPXV5010GP

1369

Side with Port Attached

MPXV5010DP

1351

Side with Part Marking

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1