Sensors

Freescale Semiconductor

3

MPX5500

Figure 3 illustrates the Differential/Gauge basic chip

carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor

diaphragm. (For use of the MPX5500D in a high pressure,

cyclic application, consult the factory.)

The MPX5500 series pressure sensor operating

characteristics, and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media,

other than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 2 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0

The output will saturate outside of the specified pressure

range.

Figure 4 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 2. Output versus Pressure Differential

Figure 3. Cross-Sectional Diagrams (not to scale)

Figure 4. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646)

Differential Pressure (kPa)

TYPICAL

MIN

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

0

50

100 150 200 250

300 350 400

450

550

500

MAX

Transfer Function:

Temperature = 0 to 85°C

Fluoro Silicone

Die Coat

Wire Bond

Die

P1

Stainless Steel

Metal Cover

Lead Frame

RTV Die

Bond

Epoxy Case

P2

+5 V

1.0

µF

0.01

µF

470 pF

GND

IPS

Output