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SL1ICS3101 数据表(PDF) 17 Page - NXP Semiconductors |
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SL1ICS3101 数据表(HTML) 17 Page - NXP Semiconductors |
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17 / 22 page ![]() Product Specification SL1 ICS31 01 Rev. 1.2 July 2000 Page 17 of 22 Public 15 Inlet/Label Characterisation and Test 15.1 Characterisation of the Inlet/Label The parameters recommended to be characterised for the inlet/label are: Parameter Symbol Conditions Threshold field strength for UNSELECTED READ command (standard mode) HTRead UNSELECTED READ command OK Threshold resonance frequency fRT Resonance frequency @ HTRead No command transmitted to the inlet/label à Label generates no response à No modulation Threshold field strength for WRITE command (standard mode) HTWrite WRITE (and Verifying READ) command OK For more detailed information on inlet /label characterisation please refer to Philips application note ‘I•CODE Label IC, Coil Design Guide’. 15.2 Final Test of the Inlet/Label Basic flow for production and test: 1. Production of wafer 2. Testing of dies on wafer 3. Writing of serial numbers and pre-configuration 4. Sawing of wafer 5. Assembly of inlets/labels 6. Final test of inlets/labels 7. Writing of customer data To detect damage of EEPROM cells during production of inlets/labels a final test of the EEPROM after assembly of the inlet/label is recommended. This is necessary to achieve lowest failure rates. |
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