Product Specification

SL1 ICS31 01

Rev. 1.2

July 2000

Page 2 of 22

Public

1 Contents

1

CONTENTS

2

2

DEFINITIONS

4

2.1

Life Support Applications .................................................................................................... 4

2.2

Abbreviations ........................................................................................................................ 4

3

SCOPE

5

4

ORDERING INFORMATION

5

5

FUNCTIONAL DESCRIPTION

6

5.1

Basic Features ....................................................................................................................... 6

5.2

Block Diagram of the IC....................................................................................................... 6

5.3

Memory Organisation........................................................................................................... 7

5.3.1

Serial Number................................................................................................................... 7

5.3.2

Write Access Conditions .................................................................................................. 7

5.3.3

Special Functions (EAS/QUIET)..................................................................................... 8

5.3.4

Family Code and Application Identifier........................................................................... 8

5.3.5

Configuration of delivered ICs......................................................................................... 8

6

MECHANICAL DIE SPECIFICATIONS

9

7

MECHANICAL WAFER SPECIFICATIONS

10

7.1

Wafer Status ........................................................................................................................ 10

7.2

Backside Treatment ............................................................................................................ 10

8

DOCUMENTATION

11

8.1

Delivery Documentation..................................................................................................... 11

8.2

Fail-Die Identification......................................................................................................... 11

8.2.1

Ink Dot Specification...................................................................................................... 11

8.2.2

Wafer Mapping............................................................................................................... 11

9

QUALITY ASSURANCE

12

9.1

Electrical Acceptance Test................................................................................................. 12

9.2

Visual Inspection................................................................................................................. 12

9.2.1

After Wafer Final Test.................................................................................................... 12

9.2.2

After Sawing (Film Frame Carrier)................................................................................ 12

10

PACKING

13

10.1 Storage Recommendations ................................................................................................. 13

10.2 Possible Forms of Delivery ................................................................................................. 13

10.2.1 Packing of Unsawn Wafers............................................................................................ 13

10.2.2 Packing of Sawn Wafers ................................................................................................ 13