LT1102

11

1102fb

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

J8 Package

8-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

OBSOLETE PACKAGES

.050

(1.270)

MAX

.016 – .021**

(0.406 – 0.533)

.010 – .045*

(0.254 – 1.143)

SEATING

PLANE

.040

(1.016)

MAX

.165 – .185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

.500 – .750

(12.700 – 19.050)

.305 – .335

(7.747 – 8.509)

.335 – .370

(8.509 – 9.398)

DIA

.230

(5.842)

TYP

.027 – .045

(0.686 – 1.143)

.028 – .034

(0.711 – 0.864)

.110 – .160

(2.794 – 4.064)

INSULATING

STANDOFF

45

°TYP

H8 (TO-5) 0.230 PCD 0801

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND THE SEATING PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

.016 – .024

(0.406 – 0.610)

*

**

PIN 1

J8 0801

.014 – .026

(0.360 – 0.660)

.200

(5.080)

MAX

.015 – .060

(0.381 – 1.524)

.125

3.175

MIN

.100

(2.54)

BSC

.300 BSC

(7.62 BSC)

.008 – .018

(0.203 – 0.457)

0

° – 15°

.005

(0.127)

MIN

.405

(10.287)

MAX

.220 – .310

(5.588 – 7.874)

12

3

4

87

65

.025

(0.635)

RAD TYP

.045 – .068

(1.143 – 1.650)

FULL LEAD

OPTION

.023 – .045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

.045 – .065

(1.143 – 1.651)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

H Package

8-Lead TO-5 Metal Can (.230 Inch PCD)

(Reference LTC DWG # 05-08-1321)