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TSB622 数据表(PDF) 23 Page - STMicroelectronics

部件名 TSB622
功能描述  High bandwidth (52 MHz), rail-to-rail output, 36 V op amp
PDF  36 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

TSB622 数据表(HTML) 23 Page - STMicroelectronics

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5.9
Settling time
Settling time in an application can be defined as the amount of time between the input changes and the output
reaching its final value. It is usually defined with a given tolerance, so the output stability is reached when the
output stays within the given range around the final value. In figures 36 and 37, the settling time is measured in an
inverting configuration, using the so-called “false summing node” circuit.
Figure 50. Settling time measurement configuration
This circuit is used with a step input voltage from a positive or negative value to 0 V. The measurement point
being (VIN - VOUT)/2, and VOUT being in an ideal circuit equal to -VIN, the measurement point gives half of the
error on VOUT, comparatively to VIN. This error is compared to the tolerance, 0.1% or 0.01% for this circuit, to
deduce the settling time. This characteristic is particularly useful when driving an ADC. It is related to the slew
rate, GBP, and stability of the circuit. It also varies with the circuit gain, the circuit load, and the input voltage step
value. However, computing the value of the settling time in a given configuration is not straightforward. The
macromodel can give a good estimation, but prototyping can be necessary for fine circuit optimization.
5.10
PCB layout recommendations
Particular attention must be paid to the layout of the PCB tracks connected to the amplifier, load, and power
supply. The power and ground traces are critical as they must provide adequate energy and grounding for all
circuits. The best practice is to use short and wide PCB traces to minimize voltage drops and parasitic
inductance. In addition, to minimize parasitic impedance over the entire surface, a multi-via technique that
connects the bottom and top layer ground planes together in many locations is often used. The copper traces that
connect the output pins to the load and supply pins should be as wide as possible to minimize trace resistance.
5.11
Macromodel
Accurate macromodels of the TSB952 device are available on the STMicroelectronics website at: www.st.com
and in the STMicroelectronics simulation software eDSim. These models are a trade-off between accuracy and
complexity (that is, time simulation) of the TSB952 operational amplifier. They emulate the nominal performance
of a typical device within the specified operating conditions mentioned in the datasheet. They also help to validate
a design approach and to select the right operational amplifier, but they do not replace on-board measurements.
TSB952
Application information
DS14576 - Rev 1
page 23/36



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