 2004 Microchip Technology Inc.

DS21170E-page 13

24C01SC/24C02SC

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

Sales and Support

PART NO.

X

/XX

XXX

Pattern

Package

Temperature

Range

Device

Device

Temperature Range

Blank

=

0

°C to +70°C

Package

S

=

Die in Wafer Pak

W=

Wafer

WF

=

Sawed Wafer on Frame

Die Thickness

Blank = 11 mils

08 = 8 mils

Other die thicknesses available, please consult factory.

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1.

Your local Microchip sales office

2.

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3.

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.