AD8123

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 3

Input Voltage (any input)

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational section of

this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

specified for the device soldered in a circuit board in still air.

Table 3. Thermal Resistance with the Underside Pad

Connected to the Plane

Package Type/PCB Type

Unit

40-Lead LFCSP/4-Layer

29

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8123 package

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the AD8123. Exceeding a junction temperature

of 175°C for an extended time can result in changes in the

silicon devices, potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

current is calculated by multiplying the load current by the

voltage difference between the associated power supply and the

output voltage. The total power dissipation due to load currents

is then obtained by taking the sum of the individual power

dissipations. RMS output voltages must be used when dealing

with ac signals.

with the package leads from metal traces, through holes, ground,

underside of the package must be soldered to a pad on the PCB

surface that is thermally connected to a solid plane (usually the

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 40-lead LFCSP

(29°C/W) on a JEDEC standard 4-layer board with the underside

paddle soldered to a pad that is thermally connected to a PCB

0

–40

–20

0

20

40

60

80

AMBIENT TEMPERATURE (°C)

1

2

3

4

5

6

7

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION