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TC429 数据表(PDF) 13 Page - Microchip Technology |
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TC429 数据表(HTML) 13 Page - Microchip Technology |
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13 / 18 page ![]() 2003 Microchip Technology Inc. DS21416C-page 13 TC429 8-Lead Ceramic Dual In-line – 300 mil (CERDIP) 10.16 9.15 8.13 .400 .360 .320 eB Overall Row Spacing 0.51 0.46 0.41 .020 .018 .016 B Lower Lead Width 1.65 1.40 1.14 .065 .055 .045 B1 Upper Lead Width 0.38 0.29 0.20 .015 .012 .008 c Lead Thickness 5.08 4.13 3.18 .200 .163 .125 L Tip to Seating Plane 10.16 9.78 9.40 .400 .385 .370 D Overall Length 7.62 6.73 5.84 .300 .265 .230 E1 Ceramic Pkg. Width 8.13 7.75 7.37 .320 .305 .290 E Shoulder to Shoulder Width 1.02 0.77 0.51 .040 .030 .020 A1 Standoff § 5.08 4.57 4.06 .200 .180 .160 A Top to Seating Plane 2.54 .100 p Pitch 8 8 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units JEDEC Equivalent: MS-030 Drawing No. C04-010 *Controlling Parameter 1 2 D n E1 c eB E p L A2 B B1 A A1 |
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