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LR024N 数据表(PDF) 2 Page - BYCHIP ELECTRONICS CO., LIMITED |
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LR024N 数据表(HTML) 2 Page - BYCHIP ELECTRONICS CO., LIMITED |
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2 / 5 page ![]() Notes: a. Pulse test; pulse width 300 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 60 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 1.0 3.0 Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 250 nA Zero Gate Voltage Drain Current IDSS VDS = 60 V, V GS = 0 V 1 µA VDS = 60 V, V GS = 0 V, TJ = 125 °C 50 VDS = 60 V, V GS = 0 V, TJ = 150 °C 250 On-State Drain Currenta ID(on) VDS 10 V, VGS = 10 V 20 A Drain-Source On-State Resistancea RDS(on) VGS = 10 V, ID = 6.6 A 0.073 VGS = 4.5 V, ID = 6 A 0.08 5 Forward Transconductancea gfs VDS = 15 V, ID = 6.6 A 25 S Dynamicb Input Capacitance Ciss VDS = 30 V, VGS = 0 V, f = 1 MHz 660 pF Output Capacitance Coss 85 Reverse Transfer Capacitance Crss 40 Total Gate Chargec Qg VDS = 30 V, VGS = 10 V, ID = 6.6 A 19.8 30 nC Gate-Source Chargec Qgs 3.6 Gate-Drain Chargec Qgd 4.1 Gate Resistance Rg f = 1 MHz 0.4 2 4 Turn-On Delay Timec td(on) VDD = 30 V, RL = 9.6 ID 5.2 A, VGEN = 10 V, Rg = 1 816 ns Rise Timec tr 11 20 Turn-Off Delay Timec td(off) 18 27 Fall Timec tf 510 Turn-On Delay Timec td(on) VDD = 30 V, RL = 9.6 ID 5.2 A, VGEN = 4.5 V, Rg = 1 38 57 Rise Timec tr 58 87 Turn-Off Delay Timec td(off) 18 27 Fall Timec tf 816 Drain-Source Body Diode Ratings and Characteristicsb TC = 25 °C Continuous Current IS 1 8 A Pulsed Current ISM 25 Forward Voltagea VSD IF = 5.2 A, VGS = 0 V 0.8 1.5 V Reverse Recovery Time trr IF = 5.2 A, dI/dt = 100 A/µs 34 51 ns Peak Reverse Recovery Current IRM(REC) 35 A Reverse Recovery Charge Qrr 50 75 nC www.bychip.cn LR024N v2.0 |
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