ADA4851-1/ADA4851-2/ADA4851-4

Rev. J | Page 10 of 24

ABSOLUTE MAXIMUM RATINGS

PD = Quiescent Power + (Total Drive Power − Load Power)

Table 4.

Parameter

Rating

Supply Voltage

12.6 V

Power Dissipation

See Figure 5

Common-Mode Input Voltage

−VS − 0.5 V to +VS + 0.5 V

Differential Input Voltage

+VS to −VS

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature

JEDEC J-STD-20

Junction Temperature

150°C

()

L

OUT

L

OUT

S

S

S

D

R

V

R

V

V

I

V

P

2

–

2

⎟

⎠

⎞

⎜

⎝

⎛

×

+

×

=

RMS output voltages should be considered. If RL is referenced

to −VS, as in single-supply operation, the total drive power is

VS × IOUT. If the rms signal levels are indeterminate, consider the

worst case, when VOUT = VS/4 for RL to midsupply.

() (

)

L

S

S

S

D

R

V

I

V

P

2

4

/

+

×

=

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

In single-supply operation with RL referenced to −VS, the worst

case is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA.

In addition, more metal directly in contact with the package

leads and through holes under the device reduces θJA.

Figure 5 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 6-lead SOT-23

(170°C/W), the 8-lead MSOP (150°C/W), and the 14-lead

TSSOP (120°C/W) on a JEDEC standard 4-layer board. θJA

values are approximations.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions; that is, θJA is specified

for device soldered in circuit board for surface-mount packages.

0

2.0

–55

125

AMBIENT TEMPERATURE (

°C)

1.5

1.0

0.5

–45 –35 –25 –15 –5

5

15253545 55657585 95 105 115

SOT-23-6

TSSOP

MSOP

Table 5. Thermal Resistance

Package Type

θJA

Unit

6-lead SOT-23

170

°C/W

8-lead MSOP

150

°C/W

14-lead TSSOP

120

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the ADA4851-1/

ADA4851-2/ADA4851-4 is limited by the associated rise in

junction temperature (TJ) on the die. At approximately 150°C,

which is the glass transition temperature, the plastic changes its

properties. Even temporarily exceeding this temperature limit

may change the stresses that the package exerts on the die,

permanently shifting the parametric performance of the

amplifiers. Exceeding a junction temperature of 150°C for an

extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the die

due to the drive of the amplifier at the output. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS).