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MPZ2012S101A 数据表(PDF) 20 Page - Texas Instruments |
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MPZ2012S101A 数据表(HTML) 20 Page - Texas Instruments |
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20 / 28 page ![]() www.ti.com BYPASSING THE BOOST CONVERTER Toko 1098AS-4R7M ToshibaCRS06 SchottkyDiode V DD SW IN– IN+ AGND PGND VOUT+ VOUT– V OUT CC V IN CC 22 F m 22 F m 1 F m ToBattery Left Channel Input C IN C IN V FB CC SDb SDd GAIN 4.7 H m GND=Bypass V =BoostMode DD 1 F m R1 50k R2 500k TPA2013D1 GPIO EFFICIENCY AND THERMAL INFORMATION JA 1 1 = = = 80.64 C/W Derating Factor 0.0124 q ° (8) TPA2013D1 SLOS520 – AUGUST 2007 Bypass the boost converter to drive the Class-D amplifier directly from the battery. Place a Shottky diode between the SW pin and the VCCIN pin. Select a diode that has an average forward current rating of at least 1A, reverse breakdown voltage of 10 V or greater, and a forward voltage as small as possible. See Figure 34 for an example of a circuit designed to bypass the boost converter. Do not configure the circuit to bypass the boost converter if VDD is higher than VCC when the boost converter is enabled (SDb ≥ 1.3 V); VDD must be lower than VCC for proper operation. VDD may be set to any voltage within the recommended operating range when the boost converter is disabled (SDb ≤ 0.3V). Place a logic high on SDb to place the TPA2013D1 in boost mode. Place a logic low on SDb to place the TPA2013D1 in bypass mode. Figure 34. Bypass Circuit The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factors for the YZH and RGP packages are shown in the dissipation rating table. Apply the same principles to both packages. Using the YZH package, and converting this to θJA: Given θJA of 80.64°C/W, the maximum allowable junction temperature of 150°C, and the maximum internal dissipation of 0.317 W (VDD = 3.6 V, PO = 1.7 W), the maximum ambient temperature is calculated with the following equation: 20 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPA2013D1 |
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