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MPZ2012S101A 数据表(PDF) 22 Page - Texas Instruments |
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MPZ2012S101A 数据表(HTML) 22 Page - Texas Instruments |
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22 / 28 page ![]() www.ti.com Trace Width TPA2013D1 SLOS520 – AUGUST 2007 Recommended trace width at the solder balls is 75 μm to 100 μm to prevent solder wicking onto wider PCB traces. For high current pins (SW, PGND, VOUT+, VOUT–, VCCIN, and VCCOUT) of the TPA2013D1, use 100 μm trace widths at the solder balls and at least 500 μm PCB traces to ensure proper performance and output power for the device. For low current pins (IN–, IN+, SDd, SDb, GAIN, VCCFB, VDD) of the TPA2013D1, use 75 μm to 100 μm trace widths at the solder balls. Run IN- and IN+ traces side-by-side to maximize common-mode noise cancellation. 22 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPA2013D1 |
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