Data Sheet

ADL5545

Rev. B | Page 5 of 18

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage, VPOS

6.5 V

Input Power (50 Ω Impedance)

18 dBm

Internal Power Dissipation

(Pad Soldered to Ground)

400 mW

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 3 lists the junction-to-air thermal resistance (θJA) and the

junction-to-case thermal resistance (θJC) for the ADL5545.

Table 3. Thermal Resistance

Package Type

θJA1

θJC2

Unit

3-Lead SOT-89 (RK-3)

53

15

°C/W

1

Measured on the ADL5545 evaluation board. For more information about

board layout, see the Soldering Information and Recommended PCB Land

Pattern section.

2

Based on simulation with a standard JEDEC board per JESD51.

ESD CAUTION