Data Sheet

ADL5545

Rev. B | Page 13 of 18

40

35

0

5

10

15

20

25

30

4.0

4.2

4.4

4.6

4.8

5.0

5.2

5.4

5.6

5.8

6.0

FREQUENCY (GHz)

GAIN, DEFAULT SETUP CONFIGURATION

GAIN, HIGH FREQUENCY CONFIGURATION

P1dB, DEFAULT SETUP CONFIGURATION

P1dB, HIGH FREQUENCY CONFIGURATION

NOISE FIGURE, DEFAULT SETUP CONFIGURATION

NOISE FIGURE, HIGH FREQUENCY CONFIGURATION

OIP3, DEFAULT SETUP CONFIGURATION

OIP3, HIGH FREQUENCY CONFIGURATION

Figure 32. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,

4 GHz to 6 GHz, Comparison of Performance

with the Optimized Settings and the Default Configuration

0

–5

–10

–15

–20

–35

–30

–25

4.0

4.2

4.4

4.6

4.8

5.0

5.2

5.4

5.6

5.8

6.0

FREQUENCY (GHz)

S11, DEFAULT SETUP CONFIGURATION

S12, DEFAULT SETUP CONFIGURATION

S22, DEFAULT SETUP CONFIGURATION

S11, HIGH FREQUENCY CONFIGURATION

S12, HIGH FREQUENCY CONFIGURATION

S22, HIGH FREQUENCY CONFIGURATION

Figure 33. Return Loss and Reverse Isolation, 4 GHz to 6 GHz,

Comparison of Performance with the Optimized Settings

and the Default Configuration

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 34 shows the recommended land pattern for the

ADL5545. To minimize thermal impedance, the exposed pad

on the underside of the SOT-89 package is soldered to a ground

plane, along with Pin 2. If multiple ground layers exist, stitch

the layers together using vias.

1.50mm

3.00mm

1.27mm

0.62mm

3.48mm

1.80mm

0.86mm

5.37mm

0.20mm

0.762mm

0.635mm

0.86mm

Figure 34. Recommended Land Pattern

The land pattern on the ADL5545 evaluation board provides a

measured thermal resistance (θJA) of 53°C/W. To measure θJA,

the temperature at the top of the SOT-89 package is found with

an IR temperature gun. Thermal simulation suggests a junction

temperature 10°C higher than the top-of-package temperature.

With additional measurements of the ambient temperature and

I/O power, θJA can be determined.